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T-Global
T-Global | Comprehensive Thermal Solution
About Company
More Innovation, Less HeatAt T-Global, we're driving innovation to tackle thermal challenges head-on. Our commitment to comprehensive thermal solutions ensures your electronic products stay cool, even in the most demanding conditions. With our cutting-edge research, flexible production, and quick customer service, we meet all your thermal management needs.
Products
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Thermal Simulation
Thermal Simulation can help ensure the performance, reliablity, safety of your electric products before you In T-Global, you can have preliminary thermal simulation planning and institutional thermal design consulting with our professional thermal engineers team.By using FloEFD's unique grid technology, we can precisely simulate real-world conditions across any complex environment, providing heat dissipation solutions and specification of heat dissipation parts.
Low Bleed Thermal Pads
1. Low bleed2. High compressibility 3. Self-adhesive4. High thermal conductivityWith low bleed and excellent electric insulation, this product is suitable for a wide range of common electronics equipment and can increase material stability and durability.Heat Transfer Coefficient from 1.8 W/m•K, 3.2 W/m•K, and 5.0 W/m•K
Non-Silicone Thermal Putty
The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating. Highly suitable for optical products, Advanced Driver Assistance Systems (ADAS), and sensitive electronic components.